MASK FABRICATION

The mask- making area is compatible with micro and nano technology. This area use an instrument laser lithography tool and some chemicals equipments.

Equipments :
DWL 200 Heidelberg Laser He-Cd (125mW, 442nm) Direct writing laser:   - On photosensitive type plates (masks 4", 5" and 7")   - On subtrates (4" and 6") Feeder system ( 1 to 10 masks) Precision stage system with two axis plane mirror interferometric system Writing time depending of minimal structure size and substrate size	Heidelberg DWL 200
APT 914 Photomask developer and wet etcher

Staff :

Pierre-François CALMON (Research Engineer - Area responsible) Jean-Christophe MARROT (Technician)

Know-how :

CHROMIUM MASK FABRICATION The Direct Writing Laser DWL 200 from Heidelberg Instruments is usually run for automatic chrome mask-making  5 inches square. These masks are used for optical lithography. The DWL 200 system is running also for chrome mask-making 2.5 ALIGNMENT AND METROLOGY The DWL 200 include an alignment system for direct writing on wafers. This process is necessary  to obtain  an alignment accuracy between 0.2 and 1 µm. The DWL 200 can be used for metrology measurement. The system measure distances between 1 µm and 200 mm with an accuracy : 0.2 µm - 1 µm depending on contrast. The metrology and alignment process allow to run automatic jobs for control quality on chrome masks.  3D MASKING An original process is used to make 3D design on photoresist with 10 µm maximum thickness