PHOTOLITHOGRAPHY

Photolithography consists in reproducing the image of a mask on a substrate covered with photosensitive resist. This resist undergoes a chemical conversion under the effect of a UV radiation. The irradiated zone will see its solubility in a developer increased or decreased according to the type of resist (positive or negative). The naked part of the substrate can then have various treatments: etching, depositions, ions implantation.

Organization :

The zone is self-service; any person wishing to work must follow a formation on the equipment after having signed the "charter of the user of the photolithography and chemistry zones ".

The photolithography zone is made up of 32 equipments on a surface of 90 m2 in class 100. It includes 2 independent parts, one manual and one automated:

- In the manual part, are a drying oven HMDS, 3 Gyrset spinners and various systems of annealing (drying ovens, hotplates), 3 exposure equipment including 2 double side, dedicated to the substrates whose diameter does not exceed 4' '.

- In the automatic part, are a drying oven HMDS, a system of coating and development resist (tracks EVG 120), an exposure equipment double face with automatic alignment (EVG 620), an semi exposure equipment (Suss Microtec MA 150), dedicated to the substrates of diameter 4 and 6' '.

Equipments :

Manual equipments:

4 Spinners; 3 of "traditional" type Gyrset and 1 SUSS MICROTEC

2 Hotplates with slope in rise and descent (2002) SUSS MICROTEC

6 Hotplates Electronic Micro Systems LTD

1 drying oven HMDS YES

2 Drying ovens: drying and bake of resist

1 Microscope LEICA

1 cooled Cupboard

1 MA6: lamp 1000W double side substrate 4", filters selection wavelength (320 or 365nm)

2 MJB3 lamp 350W

Tournettes manuelles

Etuves HMDS, tournettes et plaques chauffantes

Machines de photolithographie Manuelles

Etuve, MA6, et 2 machines MJB3

Automatic equipments:

1 Module EVG 120 for coating development and bake (7 hotplates; a module of development resist with organics or mineral developer), substrates 2 '' with 6 ''

1 exposure equipment EVG 620, automatic, double side, lamp 1000W HgXe; selection wavelength (405nm; 365nm; 320nm), substrates 2 '' with 6 ' '; 1 kit nano imprint lithography (NIL)

1 exposure equipment doubles face MA 150, SUSS MICROTEC, semi automatic with a lamp of 350W for substrate 4 ''

1 Drying oven HMDS

1 microscope LEICA

1 cooled cupboard

4 drying ovens, including 3 for the polymer bake

EVG120

EVG620 + Option NIL
EVG620 avec option Nanoimprint

MA150
Suss Microtec MA150

Supercritical drying CO2 zone:

1 Tousimis CO2 supercritical drying system

1 Recif CO2 supercritical drying and surface fictionalization prototype system

CO2 supercrique
Tousimis sécheur CO2 supercritique

Recif sécheur CO2 supercritique et traitement de surface en phase vapeur

Staff :

Véronique CONEDERA (research Engineer - Area responsible)

Laurent MAZENQ (Engineer Assistant)

Fabien MESNILGRENTE (Engineer Assistant)

Know-how :

The principal photosensitive materials used are:

Positive resists Clariant (AZ 1505, AZ1529, AZ4562),

Clariant resist lift off (AZ 5214),

Shipley (SPR 220) for thicknesses varying from 0.5µm to 20µm;

Negative resists Microchem (SU8 3005, 3025, 3050, 2075) for thicknesses varying from1µm to 500µm;

A Dow Chemical photosensitive polyimide (BCB) for thicknesses of 2.5µm and 10µm.

Negative
SU8 - 10µm SU8 10 µm

Negative
SU8 - 25µm SU8 25µm

Negative
SU8 - 50µm SU8 50µm

Negative
SU8 - 100µm

Negative
SU8 - 500µm

Positive
AZ 4562 - 10µm

Positive
AZ 1529 - 2.7µm