|
METALLIZATION
The metallization area calls upon 2 technologies for deposition which are:
- thermal evaporation : it consists in heating by Joule effect or electron gun a material which, vaporized, will settle on a substrate
- cathode sputtering: the principle of cathode sputtering is to create a plasma of a neutral gas (Ar, N2) under low pressure between 2 electrodes. One (the anode) is with the mass; the substrate and the other electrode (cathode) is with a strongly negative potential, this is the target (material to be deposited). The target is bombed by the positive ions of the plasma which tear off molecules of him. These molecules will settle on the substrate.
Organization of the zone:
The zone is not in self-service and functions thanks to a weekly planning.
The zone is made up of 7 machines of deposits including 5 groups of thermal evaporation and 2 groups of cathode sputtering.
| Equipments : |
|
Edwards 1 (evaporation)
Metal: Cr
Substrate: size 4’’
Capabilities : 5
Alim: Joule effect
Pumping: cryogénic
|
|
Edwards 2 (evaporation)
Metals : various
Substrate: size 4’’
Capabilities : 5
Alim: Joule effect
Pumping: cryogénic |
 |
| Edwards 3 (evaporation)
Metal: Al
Substrate: size 4’’
Capabilities : 5
Alim: Joule effect
Pumping: cryogénic |
 |
Alcatel 450 (cathode sputtering)
Metals: Au, AuGe, AuZn, Ni
Substrate: 2’'
Capabilities : 1
Alim: RF
Pumping : diffusion pump
|
 |
| Alcatel 600 (sputtering)
Metals: AlSi, Mo, TiW, ITO
Substrate: 4’’
Capabilities : 1
Alim: RF ou DC
Pumping: cryogénic
|
 |
| Varian 3616 (evaporation)
Metals: Au, Cr, Pt, Ti
Substrate: 4’’
Capabilities : 45
Alim: electron gun
Pumping: cryogénic
|
 |
| Veeco 770 (evaporation)
Metals : various
Substrate: 4’’
Capabilities : 1
Alim: Joule Effect
Pumping: cryogénic
|
 |
|
|
|
