PACKAGING

The stages of assembly occur at the end of the manufacturing process. When the components must be tested or used alone.

The typical sequence of components assembly breaks up the following way

- Mapping of wafers
- Dicing of wafers
- Mounting of dies on supports (gluing, eutectic, flip chip, etc.)
- Electrical connexion die/support (wire bonding, flip chip)
- Protection (glob top, etc.)

We also realise collective treatment of dies like chemical mechanical polishing, grinding, substrate bonding (thermo compression, anodic bonding, direct bonding)

Equipments :

1 Kulicke et Sofa 484 wedge thermosonic ( Al wire25 µm) -

1 Kulicke et Sofa 4127 wedge thermosonic ( Al wire 100 µm)

1 Kulicke et Sofa 4123 wedge thermosonic ( Auwire 25 µm)

Kulicke et Sofa 4124 ball thermosonic ( Au wire25 µm)

1 eutectic pick and place SET

1 eutectic pick and place KS 6482

1 pick and place Tresky 4907 -

1 probe tester SET tr5230

1 flip chip Suss Microtech FC 150 FC150 Flip Chip

1 grinder G&N MPS 300R

1 wafer bonder AML AWB04

1 scribing Karl Suss

1 scribing Marcel Aubert

1 Substrate bonder Logitech (left)

1 CMP Logitech PM5 (right)

1 profilometer Tencor P1

1 Dicing saw Disco DAD 321

1 Delvotek wedge thermosonic (Al or Au wires 25 à 100 µm)

1 CMP Logitech CDP41

New Equipments

1 ultron UH 115 wafers cleaner

1 ultron UH117 wafer mounter before dicing

1 pick and place Tresky 3000

1 wire bonder TPT HBT 16
wedge, ball, ruban bonding
Al, Au, Cu wires from 17 µm to 85 µm

1 ultrasonic driller Fischione

Staff :

Hugues GRANIER (Research Engineer - Area responsible)

Thierry DOCONTO (Technician)

David COLIN (Technical Assistant)
Samuel CHARLOT (Studies Engineer)

Know-How :

All the steps of packaging are realized using various technics
- Dicing (saw, scribber)

- Mounting on supports(eutectic bonding, manual and semi automatic pick and place, flip chip, etc.)

- Electrical connexion (Wedge, ball, ruban with differents wires diameters)

- Chemical Mecanical Polishing

- Grinding
- Substrate bonding (under vacuum, with alignment in temperature for transparent and dark substrates)